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MT9510XP

 
 
Features:
  • up to 8 contact sites
  • tri- temp from -55 to 175 °C …
  • kitable system for QFP, BGA, PGA, QFN and other packages
  • index time 0.38 sec
  • throughput up to 5,300 UPH
  • contacting: standard, high frequency and Kelvin
  • outstanding temperature performance
  • installed MT9510 base: more than 600 systems
Handling Solution for
  • large and small size packages with a pitch down to 0.3 mm
  • device size from 3x3 to 70x70mm …
  • thickness down to 0.5mm
  • wide package range:: DIP, BGA, PGA, SO, QFP, FQN, LGA, TO, CLCC, PLCC, MCM, WLP
Applications
  • automotive power devices
  • RF and communication
  • logic, analog and microcontrollers
  • processors and DSP’s …
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