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MT2168 - Benchmark Pick & Place Handler

 
Features
  • up to 16 contact sites (prepared for 32 sites)
  • index time 0.45 s
  • soak capacity for 3.5 JEDEC trays
  • temperature accuracy +/- 1.0°C
  • throughput up to 18,000 uph
  • package style conversion within 10 minutes
  • flexible contact site pitch
  • scalable configuration
Handling Solution for
  • thin and small devices (3.0 x 3.0 x 0.3 mm)
  • high pin count
  • contact pitch 0.3 mm or higher
  • ambient hot temperature range
  • wide package range: DIP, BGA, PGA, SO, QFP, QFN, LGA, TO, MCM, WLP
Applications
  • analog
  • wireless
  • micro controllers
  • high speed memory
  • broadband
  • computing
Resource Center
 MT2168 video (web friendly version) >> 
 Fact Sheet >> 
 Product Flyer >>